Picosecond laser cutting software

Mainly used in glass cutting such as mobile phone screens. The picosecond laser uses a laser beam to sweep the material to be cut multiple times. The calculation algorithm makes the laser spread on multiple levels in one plane and expands several times in height.

The hardware platform solution is rtc5 plus a motion platform control card. Achieve multiple pieces of seamless stitching, the perfect combination of processing quality and large size.

Use high-resolution camera for machining positioning and galvanometer correction. Under the magnifying glass and CCD, the stitching marks are not seen at all.